| CCGA design variables and their effects on reliability: using full array, thin ceramic substrates and lidless packages can improve the thermal cycle fatigue ... An article from: Circuits Assembly |  | Authors: Marie S. Cole, Ellyn Ingalls, Gregory B. Martin, Cynthia Milkovich
Brand: The Gale Group
Category: Book
Buy New: $5.95
Format: Html
Media: Digital
Publication Date: January 1, 2002
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Product Description
This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on January 1, 2002. The length of the article is 3411 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: CCGA design variables and their effects on reliability: using full array, thin ceramic substrates and lidless packages can improve the thermal cycle fatigue life of CCGAs.(Components)
Author: Marie S. Cole
Publication: Circuits Assembly (Magazine/Journal)
Date: January 1, 2002
Publisher: UP Media Group, Inc.
Volume: 13 Issue: 1 Page: 66(6)
Distributed by Thomson Gale
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