| Ceramic Interconnect Technology Handbook | 
 enlarge | Creators: Iii, Fred D. Barlow, Aicha Elshabini
Publisher: CRC
Category: Book
List Price: $129.95
Buy New: $100.48
You Save: $29.47 (23%)
Sales Rank: 1771613
Media: Hardcover
Edition: 1
Number Of Items: 1
Pages: 456
Shipping Weight (lbs): 1.6
Dimensions (in): 9.3 x 6.1 x 1.1
ISBN: 0849335574
Dewey Decimal Number: 621.381046
EAN: 9780849335570
Publication Date: January 24, 2007
Availability: Usually ships in 1-2 business days
Condition: New & Shrinkwrapped. In stock - Immediate despatch from an efficient and professional leading British bookselling firm.
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Product Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
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